Comparison ledger
Besi 2009 SSI E, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 2009 SSI EBesi | 10490West Bond |
|---|---|---|
| OEM | Besi | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | Single Wafer Loader | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Besi 2009 SSI E | West Bond 10490 |
| Cited variants |
| — |
| Specifications | ||
| Configuration | SoftSolder Wire Dispense (OMP1,OMP780 and OMP1230)[1] | — |
| Wafer size | Single Wafer Loader[1] | — |
| SoftSolder Wire Dispense | OMP1, OMP780, OMP1230[1] | — |
| Wafer Handling | Single Wafer Loader[1] | — |
| Handling | Magazine to Magazine[1] | — |
| Vintage | 2014[1] | — |
| Type | Die Bonder[1] | — |
| Process capabilities | SoftSolder Wire Dispense (OMP1, OMP780, OMP1230)[1] | — |
| Material handling | Magazine to Magazine[3] | — |
| Make | Besi / Datacon[1] | — |
| Model | 2009 SSI E[1] | 10490[4] |
| SoftSolder Wire Dispense Options | OMP1, OMP780, OMP1230[1] | — |
| Wafer Loader | Single Wafer Loader[1] | — |
| Equipment type | Die bonder[1] | — |
| Wire dispense | SoftSolder wire dispense[1] | — |
| Compatible OMPs | OMP1, OMP780, and OMP1230[1] | — |
| Loader type | Single Wafer Loader[1] | — |
| Handling mode | Magazine to Magazine[1] | — |
| Manufacturer | — | West Bond[4] |
| Description | — | Convertible bonder, wedge to ball[5] |
| Tool type | — | Convertible bonder[6] |
| Bonding modes | — | Wedge bonding and ball bonding[6] |
| Use | — | Wire bonding[6] |
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