Comparison ledger
Axcelis 200 PCU Photoresist Stabilizer, SUSS MicroTec Delta 12 AQ, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Delta 12 AQSUSS MicroTec | |
|---|---|---|
| OEM | Axcelis | SUSS MicroTec |
| Category | Resist Processing | Resist Processing |
| Wafer size | — | Wafer Developing System Configuration |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Axcelis NV GSD 200 | SUSS MicroTec Delta |
| Specifications | ||
| Configuration | 14 Amps[1] | Software is not included[3] |
| Voltage | 380 V[1] | — |
| Frequency | 50 Hz[1] | — |
| Phase | 3 Phase[1] | — |
| Maximum wafer diameter | — | 200 mm (8 in)[4] |
| Maximum substrate thickness | — | 5 mm[4] |
| Supported wafer diameters | — | 50 mm (2 in), 75 mm (3 in), 100 mm (4 in), 150 mm (6 in), 200 mm (8 in)[4] |
| Supported photomask sizes | — | 125 mm x 125 mm, 150 mm x 150 mm[4] |
| Supported developer chemistries | — | AZ400K, AZ300MIF, CD26[4] |
| Process type | — | temperature controlled spray photoresist development, cassette-to-cassette, dry in – dry out[4] |
| Operation control | — | Recipe controlled automated operation with precise temperature control[4] |
| Wafer size | — | Wafer Developing System Configuration |
| Vintage | — | 2009 |
| Coaters & Developers Vintage | — | 2009 |
| Development method | — | temperature controlled spray development[4] |
| Operation mode | — | cassette-to-cassette, recipe controlled[4] |
| Small pieces supported | — | No[4] |
Plan your fab
Building a Resist Processing process? Get a complete equipment list.
Open the fab equipment planner →