Waferpedia

Comparison ledger

200 PCUversusGSD 200 E 2

Axcelis 200 PCU, Axcelis GSD 200 E 2, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
200 PCUAxcelis
OEMAxcelisAxcelis
CategoryIon ImplantationIon Implantation
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones2000 Vintage—
Control system——
Generation——
FamilyAxcelis NV GSD 200Axcelis GSD 200 E 2
Cited variants
  • Fusion 200 PCU[1]
  • Fusion 200 PCU-P[2]
—
Specifications
P/NSC 4840 A[3]—
Frequency50 Hz[3]50 Hz[4]
Phase3 Phase[3]3 Phase[4]
Voltage400 V[3]208 V[4]
Type—High Current ion implanter[5]
Energy—180 KeV[5]
Wafer Size—8 inch (200 mm)[5]
Power Requirements—208 V, 125 A, 50 Hz, 3 Phase[4]
Vintage (listed unit 158479)—2000[6]
Vintage (listed unit 158478)—2004[4]
Maximum Energy—180 keV[5]
Current—125 A[4]
Energy Rating—180KeV[5]
Amperage—125 A[4]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]exapro.comexapro.com
  2. [2]fabsurplus.comfabsurplus.com
  3. [3]inventory listing
  4. [4]inventory listing
  5. [5]asseta.comasseta.com
  6. [6]Equipment inventory listing