Waferpedia

Comparison ledger

200 ACUversusTE 8401 Poly

Axcelis 200 ACU, Tokyo Electron TE 8401 Poly, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
200 ACUAxcelis
TE 8401 PolyTokyo Electron
OEMAxcelisTokyo Electron
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAxcelis NV GSD 200Tokyo Electron TE 8401
Cited variants—
  • TE 8401 (poly etch configuration)[1]
  • TE 8401 (nitride etch configuration)[1]
Specifications
ConfigurationParts Machine[2]Single chamber[6]
ManufacturerAxcelis[2]Tokyo Electron[6]
Model200 ACU[2]TE 8401 Poly[6]
Tool typeAsher[2]—
Wafer size200mm[4]8-inch wafers[1]
Serial numberAU6A356AH[4]—
Computer systemM 200 PC, M 200[5]—
Part numberSC 4572 A[5]—
Volts208[5]—
Amps30[5]—
Equipment typeAsher[2]—
Wafer configuration8 inch[3]—
LD—2 each[6]
Gas—He, O2, CF4, HBr, CL2[6]
OS—EPROM based system[6]
Pumps—2[6]
Gas delivery—He, O2, CF4, HBr, CL2[6]
Vintage—1998[6]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]inventory listing
  3. [3]semistarcorp.comsemistarcorp.com
  4. [4]wotol.comwotol.com
  5. [5]semistarcorp.comsemistarcorp.com
  6. [6]inventory listing