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Comparison ledger

Twinscan NXT 2050 i Immersionversus150 e Mask

ASML Twinscan NXT 2050 i Immersion, SUSS MicroTec 150 e Mask, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
150 e MaskSUSS MicroTec
OEMASMLSUSS MicroTec
CategoryLithographyLithography
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyASML Twinscan NXT 2050 i ImmersionSUSS MicroTec 150 e Mask
Specifications
Wafer size12 inch[1]—
Exposure wavelength193 nm ArF[2]—
Optics typeImmersion[2]—
Stage designDual-stage[2]—
Throughputwell above 250 wafers per hour under volume conditions[2]—

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Sources (2)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]ad-hoc-news.dead-hoc-news.de