Comparison ledger
Applied Materials Reflexion LK, Lapmaster 120 Continuous, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Reflexion LKApplied Materials | 120 ContinuousLapmaster |
|---|---|---|
| OEM | Applied Materials | Lapmaster |
| Category | CMP | CMP |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials Reflexion | Lapmaster 120 Continuous |
| Specifications | ||
| Configuration | Miniship[1] | — |
| Wafer size | 300 mm[3] | — |
| Removal rate | >6452 Å/min[3] | — |
| Non-uniformity | <4%[3] | — |
| Pressure | 1.5 psi[3] | — |
| Slurry flow rate | 300 ml/min[3] | — |
| Platen/Carrier rotary speed | 97/103 rpm[3] | — |
| Gas delivery | 300 ml/min[1] | — |