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Comparison ledger

DPS II CIPversus200 ACU

Applied Materials DPS II CIP, Axcelis 200 ACU, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
DPS II CIPApplied Materials
200 ACUAxcelis
OEMApplied MaterialsAxcelis
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials DPSAxcelis NV GSD 200
Specifications
Configuration4x (D4) SILICON DPS II chamber, 12 Gas line (Standard Gas Line)[1]Parts Machine[3]
Applicable2 Chiller[1]—
Not applicableScrubber, Dry Pump[1]—
OEMApplied Materials[1]—
ModelDPS II CIP[1]200 ACU[3]
CategoryEtch[2]—
Tool typeEtcher[2]Asher[3]
Chamber4x (D4) SILICON DPS II chamber[1]—
Gas line12 Gas line (Standard Gas Line)[1]—
Chiller2 Chiller applicable[1]—
ScrubberNot applicable[1]—
Dry pumpNot applicable[1]—
Vintage2005[1]—
Manufacturer—Axcelis[3]
Wafer size—200mm[5]
Serial number—AU6A356AH[5]
Computer system—M 200 PC, M 200[6]
Part number—SC 4572 A[6]
Volts—208[6]
Amps—30[6]
Equipment type—Asher[3]
Wafer configuration—8 inch[4]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]inventory listing
  4. [4]semistarcorp.comsemistarcorp.com
  5. [5]wotol.comwotol.com
  6. [6]semistarcorp.comsemistarcorp.com