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Comparison ledger

Centura DPS Polyversus1512e

Applied Materials Centura DPS Poly, Tegal 1512e, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
Centura DPS PolyApplied Materials
1512eTegal
OEMApplied MaterialsTegal
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials Centura DPS PolyTegal 1512e
Cited variants
  • Centura DPS IIDPS II[1]
—
Specifications
Wafer Size6 inch[2]—
Tool TypePoly Etcher[2]—
Plasma Source TypeDecoupled Plasma Source (DPS)[1]—
RF Pulsing Frequency1 kHz to 5 kHz[1]—
Chamber Coating MaterialAlumina or Y2O3[1]—
Supported Process Node28 nm[1]—
Tool type—Industrial RIE plasma etcher system[3]
Stated configuration—With modules assembly for CI-4222[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]chinsortech.comchinsortech.com
  2. [2]Equipment inventory listing
  3. [3]semistarcorp.comsemistarcorp.com