Waferpedia

Comparison ledger

Centura 5200 Dryversus1512e

Applied Materials Centura 5200 Dry, Tegal 1512e, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
Centura 5200 DryApplied Materials
1512eTegal
OEMApplied MaterialsTegal
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials Centura 5200Tegal 1512e
Specifications
Configuration50/60 Hz[1]—
Voltage208V[1]—
Process typeDry etching[1]—
Wafer size8 inch[1]—
Wafer size (version)200 mm[2]—
Electrical: frequency50/60 Hz[1]—
Electrical: voltage208V[1]—
Electrical: current240A[1]—
Chamber configuration2 Chamber dps Metal, 2 Chamber asp+[2]—
Tool type—Industrial RIE plasma etcher system[3]
Stated configuration—With modules assembly for CI-4222[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]fabsurplus.comfabsurplus.com
  3. [3]semistarcorp.comsemistarcorp.com