Comparison ledger
Applied Materials 0720 06060 Part, Semics Opus 3, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0720 06060 PartApplied Materials | Opus 3Semics |
|---|---|---|
| OEM | Applied Materials | Semics |
| Category | Test & Probe | Test & Probe |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | MS Windows XP Professional |
| Generation | — | — |
| Family | Applied Materials 0720 06060 Part | Semics Opus |
| Specifications | ||
| Configuration | Contact Pin 24-20 Awg Crimp Gold Flash[1] | 15 A[2] |
| Power Supply | — | 200-240 V[2] |
| Full Load Current | — | 11 A[2] |
| Max Ampere Rating | — | 25 A[5] |
| Interruption Capacity | — | 10 kA[5] |
| Power Supply Voltage | — | 200-240 V[2] |
| Power Supply Current | — | 15 A[2] |
| Power Supply Frequency | — | 50/60 Hz[2] |
| Wafer Sizes | — | 8 inch, 12 inch[4] |
| Hot Chuck | — | Included[4] |
| Communication Interface | — | GPIB[4] |
| Operating System | — | MS Windows XP Professional[4] |
| Type | — | Prober[2] |
| Communication | — | GBIP[4] |
| Vintage | — | 2014, 2015, 2016, 2017 (observed units)[2] |
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