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Comparison ledger

0041-26723 Bonded Assemblyversus8060 Wedge

Applied Materials 0041-26723 Bonded Assembly, Kulicke & Soffa 8060 Wedge, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
8060 WedgeKulicke & Soffa
OEMApplied MaterialsKulicke & Soffa
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones—1999 Vintage year of known unit · 2000 Vintage date of known unit
Control system——
Generation——
FamilyApplied Materials 0041-26723 Bonded AssemblyKulicke & Soffa 8060 Wedge
Specifications
Bonding Type—Wedge[1]
Automation Level—Automatic[2]
Wire Materials—Gold, Aluminum[2]
Wafer Size—200 mm[2]
Manufacturer—Kulicke & Soffa[1]
Model—8060 Wedge[3]
Category—Packaging & Bonding[1]
Machine type—Packaging and bonding machine[1]
Bonder type—Automatic gold and aluminum wedge bonder[2]
Vintage year—1999[4]
Vintage date—2000-09-01[2]
Software Version—P805747[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]fabsurplus.comfabsurplus.com
  3. [3]Equipment inventory listing
  4. [4]lislesurplus.comlislesurplus.com