Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, EV Group 620 BA, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | 620 BAEV Group |
|---|---|---|
| OEM | Applied Materials | EV Group |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | EV Group 620 BA |
| Specifications | ||
| Alignment method | — | Backside alignment, transparent alignment, IR alignment (optional)[1] |
| Backside alignment accuracy | — | ±2 µm (3σ)[1] |
| Transparent alignment accuracy | — | ±1 µm (3σ)[1] |
| Wafer sizes | — | 2", 3", 100 mm, 150 mm[1] |
| Wafer thickness | — | 0.1 - 10 mm[1] |
| Max stack height | — | 10 mm[1] |
| Configuration | — | Desktop with optional system rack[1] |
| Vibration isolation | — | Passive[1] |
| Alignment stage | — | Manual precision micrometers, optional motorized, automated wedge compensation[1] |
| Microscopes | — | Fully motorized high-resolution bottom-side microscopes[1] |
| User interface | — | Windows-based[1] |
| Handling | — | Standard 3 cassette stations, optional up to 5 stations[1] |
| Automatic alignment | — | Optional[1] |
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