Waferpedia

Comparison ledger

0020 17485 Partversus3118 10 E E-Beam

Applied Materials 0020 17485 Part, Varian 3118 10 E E-Beam, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0020 17485 PartApplied Materials
OEMApplied MaterialsVarian
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0020 17485 PartVarian 3118 10 E E-Beam
Specifications
ConfigurationStrap, RF Out 2 Balanced Coil Match, Hdp[1]Integrated System[2]
Chiller—Lamb UC 50/30, low temperature recirculating[2]
Power unit—ARCO Temescal, high voltage[2]
Sweep controller—Temescal CV 8, for beam positioning and deposition uniformity[2]
Optical monitor—DYN-Optics 580 D, real time film thickness and deposition control[2]
Included components—Vacuum pumps, chamber, mounting pieces[2]
System integration—Components mounted in standard racks[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing