Waferpedia

Comparison ledger

0010 47763versusTrias 200 SPA

Applied Materials 0010 47763, Tokyo Electron Trias 200 SPA, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010 47763Applied Materials
Trias 200 SPATokyo Electron
OEMApplied MaterialsTokyo Electron
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010 47763Tokyo Electron Trias 200 SPA
Cited variants—
  • TEL Trias 200 SPA (Dry Etch)[1]
  • TEL Trias 200 SPA (CVD)[2]
Specifications
Configuration2nd Source New[3]—
TypeMonopolar Dual Heated[4]—
DescriptionASSY, ESC, BONDED, MONOPOLAR DUAL HEATED[5]—
Possible MaterialsAl2O3 (aluminum oxide) or AlN (aluminum nitride)[4]—
Model0010-47763[3]—
OEMApplied Materials[3]—
Material (possible)Al2O3 (aluminum oxide) or AlN (aluminum nitride)[4]—
ApplicationFixing wafers in etching process (PVD, CVD, ETCH)[4]—
Quantity available (source)1[4]—
Wafer Size—300 mm[1]
Process Type—Dry Etch[1]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]fabsurplus.comfabsurplus.com
  2. [2]fabsurplus.comfabsurplus.com
  3. [3]inventory listing
  4. [4]saulcontrol.comsaulcontrol.com
  5. [5]getspares.comgetspares.com