Waferpedia

Comparison ledger

0010 47763versusCentura II

Applied Materials 0010 47763, Applied Materials Centura II, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010 47763Applied Materials
Centura IIApplied Materials
OEMApplied MaterialsApplied Materials
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010 47763Applied Materials Centura
Cited variants—
Specifications
Configuration2nd Source New[2]DPS + Metal[5]
TypeMonopolar Dual Heated[3]—
DescriptionASSY, ESC, BONDED, MONOPOLAR DUAL HEATED[4]—
Possible MaterialsAl2O3 (aluminum oxide) or AlN (aluminum nitride)[3]—
Model0010-47763[2]Centura II[1]
OEMApplied Materials[2]Applied Materials[1]
Material (possible)Al2O3 (aluminum oxide) or AlN (aluminum nitride)[3]—
ApplicationFixing wafers in etching process (PVD, CVD, ETCH)[3]Poly / Metal / Oxide etch[6]
Quantity available (source)1[3]—
Category—Etch[1]
Wafer sizes—6 inch[5]
Configuration / options—DPS + Metal[1]
Chamber—DPS II / DPS / Super E / eMxP+ / MxP+ / MxP / eMAX[6]
Wafer size—6 inch[5]
Chamber options—DPS II, DPS, Super E, eMxP+, MxP+, MxP, eMAX[1]

Plan your fab

Building a Etch process? Get a complete equipment list.

Open the fab equipment planner →
Sources (6)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]inventory listing
  3. [3]saulcontrol.comsaulcontrol.com
  4. [4]getspares.comgetspares.com
  5. [5]inventory listing
  6. [6]semistarcorp.comsemistarcorp.com