Waferpedia

Comparison ledger

0010-22161 High EFF RF Matchversus5100

Applied Materials 0010-22161 High EFF RF Match, KLA 5100, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
5100KLA
OEMApplied MaterialsKLA
Category——
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-22161 High EFF RF MatchKLA 5100
Cited variants—
  • 5100 XP Overlay Measurement[1]
Specifications
MakeApplied Materials[2]—
Model0010-22161[2]—
DescriptionHTESC PH 1 REV A[3]—
ConditionUsed[3]—
Stock NumberBM6628[3]—
Step measurement range—100 Å to 300 µm[4]
Sample table—200 mm with vacuum[4]
Maximum sample thickness—20 mm[4]
Minimum sample length—25 mm[4]
Wafer handling—Dual SMIF Cassette loader, 200mm[4]
Optics—12k and 750 micron FOV optical microscopes with light source[4]
Microscope—50 micron FOV with optical measurement, interferometer measurement, and autofocus[4]
Software—Windows NT / VAX[4]
Operating system—VMS[4]
Backup—SCSI back up unit[4]
Printer—Thermal mini printer[4]
Tool type—metrology and inspection tool[4]
Measurement application—overlay measurement on wafers[4]
Wafer size—8-inch wafers[4]
Optical system—optical microscopes for measurement functions[4]
Microscope set—12k microscope and a 750 micron field-of-view microscope with a light source[4]
Microscope functions—50 micron field-of-view microscope performs optical measurement, interferometer measurement, and autofocus[4]
Measurement range—100 Å to 300 µm[4]
Control software—Windows NT / VAX software[4]
Backup unit—SCSI Back up unit[4]
Sources (4)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]Equipment inventory listing
  3. [3]tarasemi.comtarasemi.com
  4. [4]waferpedia.comwaferpedia.com