Comparison ledger
Applied Materials 0010-22161 High EFF RF Match, Branson IPC 2000 / 3000, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-22161 High EFF RF MatchApplied Materials | IPC 2000 / 3000Branson |
|---|---|---|
| OEM | Applied Materials | Branson |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-22161 High EFF RF Match | Branson IPC 2000 / 3000 |
| Specifications | ||
| Make | Applied Materials[1] | — |
| Model | 0010-22161[1] | IPC 2000 / 3000[3] |
| Description | HTESC PH 1 REV A[2] | — |
| Condition | Used[2] | — |
| Stock Number | BM6628[2] | — |
| Configuration | — | Refurbished[3] |
| Manufacturer | — | Branson[3] |
| Equipment family | — | Branson/IPC 2000, 3000, and 4000 Series manual plasma systems[4] |
| Loading | — | Manual load / unload[4] |
| Process type | — | Plasma ashing, descum, dry cleaning, surface treatment, or plasma etching depending on configuration[4] |
| Wafer / sample size | — | Small samples up to 8 inch wafers depending on model and chamber configuration[4] |
| Chamber type | — | Quartz chamber for ashing / descum or metal chamber for etching depending on model[4] |
| RF power | — | Configuration dependent[4] |
| Gas lines | — | Configuration dependent[4] |
| Wafer quantity per run | — | Configuration dependent[4] |
| Operation | — | Automatic, semi-automatic, or manual depending on controller configuration[4] |
| PC controller upgrade option | — | Available for selected working systems, subject to evaluation[4] |
| Model family | — | IPC 2000 / 3000 family[5] |