Waferpedia

Comparison ledger

0010-16392 ESC AssemblyversusCentura DPS Poly

Applied Materials 0010-16392 ESC Assembly, Applied Materials Centura DPS Poly, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-16392 ESC AssemblyApplied Materials
Centura DPS PolyApplied Materials
OEMApplied MaterialsApplied Materials
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-16392 ESC AssemblyApplied Materials Centura DPS Poly
Cited variants—
  • Centura DPS IIDPS II[1]
Specifications
OEMApplied Materials[2]—
Model0010-16392[2]—
TypeESC Assembly[2]—
Wafer Size300 mm[3]6 inch[4]
Electrode ConfigurationDual[3]—
Tool Type—Poly Etcher[4]
Plasma Source Type—Decoupled Plasma Source (DPS)[1]
RF Pulsing Frequency—1 kHz to 5 kHz[1]
Chamber Coating Material—Alumina or Y2O3[1]
Supported Process Node—28 nm[1]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]chinsortech.comchinsortech.com
  2. [2]Equipment inventory listing
  3. [3]spwindustrial.comspwindustrial.com
  4. [4]Equipment inventory listing