Comparison ledger
Applied Materials 0010-14300 Magnet Assy, Axcelis GSD 200 E 2 Ion, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-14300 Magnet AssyApplied Materials | GSD 200 E 2 IonAxcelis |
|---|---|---|
| OEM | Applied Materials | Axcelis |
| Category | Ion Implantation | Ion Implantation |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-14300 Magnet Assy | Axcelis GSD 200 |
| Specifications | ||
| Configuration | P4 Magnet Assy, IMP[1] | Software Version 6.12.3[2] |
| Gearbox P/N | 0010-27417[1] | — |
| Part Number | 0010-14300[1] | — |
| Description | P4 Magnet Assy, IMP[1] | — |
| High Current | — | GSD-200EE[2] |
| Ion Source Type | — | ELS[2] |
| Source Material Type | — | Moly[2] |
| Single Stage Extraction | — | 90keV[2] |
| Beamline Version | — | Standard[2] |
| Source Turbo Pump (P1) | — | STP H2000C[2] |
| Beam Line Cryo Pump (P3) | — | CTI Onboard 10[2] |
| End Station Cryo Pump (P2) | — | CTI Onboard 8[2] |
| Manufacturer | — | Axcelis[2] |
| Model | — | GSD 200 E 2[2] |
| Category | — | Ion Implantation[3] |
| Wafer size | — | 6 inch[2] |
| Software version | — | 6.12.3[2] |
| GEM/SECS interface | — | Present[2] |
| Cassette capability | — | 4-cassette capability[2] |
| Automated beam tuning and set-up | — | w/Eaton Autotune[2] |
| Energy range | — | 90KeV[2] |
| Beamline and source pumps | — | Beamline and Source Pumps[3] |
| Gas Type | — | MFC Type and Model[2] |
| Ar | — | UNIT 1662 10SCCM - SDS[2] |
| BF3 | — | UNIT 1662 10SCCM - SDS[2] |
| AsH3 | — | UNIT 1662 10SCCM - SDS[2] |
| PH3 | — | UNIT 1660 10SCCM - SDS[2] |
| External Facilities Connections | — | Ar N2[2] |
| Cryo Compressors | — | CTI 9600 (1)[2] |
| Remote Disk Chiller | — | SMC-HRS050[2] |
| Interface | — | GEM/SECS[2] |
| Signal tower | — | Present[2] |
| Injector | — | Flag Faraday Injector[2] |
| Drive | — | Direct Rotory Drive[2] |
| Beamline | — | Enhanced Low Energy Beamline[2] |
| Process disk | — | Process Disk w/Active Cooling & Chiller[2] |
| Extraction | — | Single Stage Extraction: 90keV[2] |
| Block upgrade | — | Present[2] |
| Wafer alignment | — | Automatic Flat or Notch Alignment Capability w/buffer cassette[2] |
| Gas type - Ar MFC | — | UNIT 1662 10SCCM - SDS[2] |
| Gas type - BF3 MFC | — | UNIT 1662 10SCCM - SDS[2] |
| Gas type - AsH3 MFC | — | UNIT 1662 10SCCM - SDS[2] |
| Gas type - PH3 MFC | — | UNIT 1660 10SCCM - SDS[2] |
| Family | — | GSD 200 family[3] |
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