Comparison ledger
Applied Materials 0010-13622 RF Match for, Oxford Instruments FlexAL, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-13622 RF Match forApplied Materials | FlexALOxford Instruments |
|---|---|---|
| OEM | Applied Materials | Oxford Instruments |
| Category | Deposition | Deposition |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-13622 RF Match for | Oxford Instruments FlexAL |
| Cited variants | — |
|
| Specifications | ||
| Configuration | High Efficiency HE RF Match-Bias[2] | Compatible with TiN, TaN, TiO, TaO, SiN[3] |
| Model | 0010-13622[2] | — |
| Product Type | RF Match for PVD (Physical Vapor Deposition)[2] | — |
| Feature | High Efficiency HE RF Match-Bias[2] | — |
| Gases | — | BTBAS, TBTDMT, TDMAT, CF4[3] |
| Deposition method | — | Atomic layer deposition (ALD), thermal and plasma-assisted[1] |
| Wafer size | — | up to 200 mm[4] |
| Substrate temperature range | — | up to 550 °C[4] |
| Chamber temperature | — | up to 150 °C[4] |
| Film types (commissioned) | — | Al2O3, TiO2, HfO2, SiO2[1] |
| Film types (high-quality nitride superconductors) | — | NbN, TiN[4] |
| Precursors (examples) | — | TMA, TIIP, TEMAH, BTBAS, TBTDMT, TDMAT[1] |
| Gases (from listing) | — | BTBAS, TBTDMT, TDMAT, CF4[3] |
| Ozone generator | — | yes[4] |
| Residual gas analyser | — | yes[4] |
| Optical emission spectrometer (integrated) | — | yes[4] |
| Glove box (inert atmosphere) | — | yes[4] |
| Source configuration | — | remote plasma and thermal[4] |
| Cluster capability | — | shared loadlock with PlasmaLab 100 PECVD[1] |
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