Comparison ledger
Applied Materials 0010-13622 RF Match for, CHA Mark 40 E-Beam, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-13622 RF Match forApplied Materials | |
|---|---|---|
| OEM | Applied Materials | CHA |
| Category | Deposition | Deposition |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-13622 RF Match for | CHA Mark 40 E-Beam |
| Specifications | ||
| Configuration | High Efficiency HE RF Match-Bias[1] | — |
| Model | 0010-13622[1] | — |
| Product Type | RF Match for PVD (Physical Vapor Deposition)[1] | — |
| Feature | High Efficiency HE RF Match-Bias[1] | — |
| Type | — | E-Beam Evaporator[2] |
| Process | — | Physical Vapor Deposition (PVD)[3] |
| Electron Beam Gun | — | 4-pocket, up to 4 metal materials[3] |
| Power Supply | — | CHA SR10 electron beam power supply[3] |
| Valve Controller | — | Autotech II[3] |
| Cryopump | — | CTI 8[3] |
| Compressor | — | CTI[3] |
| Wafer Size | — | 200 mm (version)[4] |
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