Waferpedia

Comparison ledger

ATC 2200versus0020 12458 Part

AJA ATC 2200, Applied Materials 0020 12458 Part, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0020 12458 PartApplied Materials
OEMAJAApplied Materials
CategoryDepositionDeposition
Wafer size6"—
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAJA ATC 2200Applied Materials 0020 12458 Part
Specifications
Tool typePVD tool; UHV sputtering system[1]—
Sputtering sources330-XP (UHV) magnetron sputtering sources in con-focal orientation[1]—
Source shuttersPneumatic source shutters[1]—
Gas injectionIntegral gas injection to source head for reactive sputtering and low pressure operation[1]—
Tilt adjustmentIn-situ tilt gimbals with locking UHV position indicator; allows source head angle adjustment without breaking vacuum[1]—
Viewports6" CF viewports[1]—
Substrate sizeTo 6"[1]—
HeatingRadiant heating to 800 C with quartz halogen lamps[1]—
Power sourcesDC and RF generators[1]—
Ion sourceKaufman KDC 40 4cm gridded ion source[1]—
Control systemPhase II-J Computer Control System[1]—
Process typePVD sputtering system[1]—
Magnetron sources330-XP (UHV) magnetron sputtering sources in confocal orientation[1]—
Reactive sputtering gas injectionIntegral gas injection to source head for reactive sputtering and low pressure operation[1]—
Source head adjustmentIn-situ tilt gimbals with locking UHV position indicator[1]—
Viewport size6" CF viewports[1]—
Power suppliesDC and RF generators[1]—
Configuration—Insulator,Side Match,Hdp-Cvd Ultima Plus[2]
Asset number—146526[2]
Make—Applied Materials[2]
Model—0020 12458[2]

Plan your fab

Building a Deposition process? Get a complete equipment list.

Open the fab equipment planner →
Sources (2)Every fact above is drawn from these public sources
  1. [1]pnf.uchicago.edupnf.uchicago.edu
  2. [2]inventory listing