Waferpedia

Comparison ledger

10490versus7416A

West Bond 10490, West Bond 7416A, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
10490West Bond
7416AWest Bond
OEMWest BondWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyWest Bond 10490West Bond 7416A
Specifications
ManufacturerWest Bond[1]—
Model10490[1]7416A[5]
DescriptionConvertible bonder, wedge to ball[2]—
Tool typeConvertible bonder[3]—
Bonding modesWedge bonding and ball bonding[3]—
UseWire bonding[3]—
Equipment type—Wire bonder[4]
Bonding method—Thermocompression wedge[4]
Wire bond style—Wedge[6]
Operation—Manual[6]
Channels—2 (CHAN 1 and CHAN 2)[6]
Input voltage—115V AC, 50/60 Hz[6]
Wire range—0.5 mil (12 microns) to 2 mil (50 microns)[5]
Form factor—Benchtop[6]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]fabsurplus.comfabsurplus.com
  3. [3]waferpedia.comwaferpedia.com
  4. [4]semistarcorp.comsemistarcorp.com
  5. [5]jmind.comjmind.com
  6. [6]recycledgoods.comrecycledgoods.com