Waferpedia

Comparison ledger

PR-1versus10490

View Engineering PR-1, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
PR-1View Engineering
10490West Bond
OEMView EngineeringWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced1978—
Production run1978–—
LifecycleDiscontinued—
Lifecycle milestones——
Control system——
Generation——
FamilyView Engineering PR-1West Bond 10490
Specifications
Image typebinary image[1]—
Functionpattern recognition system[1]—
Applicationsautomated wirebonding machines and wafer probers[1]—
TechnologyBinary image pattern recognition (template matching)[1]—
ApplicationAutomated wirebonding machines and wafer probers[1]—
Manufacturer—West Bond[2]
Model—10490[2]
Description—Convertible bonder, wedge to ball[3]
Tool type—Convertible bonder[4]
Bonding modes—Wedge bonding and ball bonding[4]
Use—Wire bonding[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]en.wikipedia.orgen.wikipedia.org
  2. [2]Equipment inventory listing
  3. [3]fabsurplus.comfabsurplus.com
  4. [4]waferpedia.comwaferpedia.com