Waferpedia

Comparison ledger

160 XP Ionversus350D

Varian 160 XP Ion, Varian 350D, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
350DVarian
OEMVarianVarian
CategoryIon ImplantationIon Implantation
Wafer size——
Process node——
Introduced—1986
Production run—1986–
Lifecycle—Discontinued
Lifecycle milestones——
Control system——
Generation——
FamilyVarian 160 XP IonVarian 350D
Specifications
Configuration150mm High Current IMP[1]—
OEMVarian[2]—
Model160 XP Ion[2]—
CategoryIon Implantation[1]—
Tool typeion implanter[1]—
Type—medium current implanter[3]
Relationship to 300 XP—industry-standard predecessor platform that the 300 XP evolved from[3]
Usage period—tool of choice during the early 1980s[3]
Wafer sizes—4 inch and 6 inch[4]
Implant species—Boron (B11 or BF2) and Phosphorus (P31)[4]
Energy range—10 keV to 200 keV[4]
Dose range—1E12 to 5E15 ions/cm²[4]
End stations—Independent dual end stations[3]
Wafer handling—Vertical, edge-only wafer handling[3]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]Equipment inventory listing
  3. [3]web.archive.orgweb.archive.org
  4. [4]yumpu.comyumpu.com