Waferpedia

Comparison ledger

1000 FamilyversusAP200

Ultratech 1000 Family, Ultratech AP200, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
1000 FamilyUltratech
AP200Ultratech
OEMUltratechUltratech
CategoryLithographyLithography
Wafer size——
Process node——
Introduced—2004
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyUltratech 1000 FamilyUltratech AP200
Specifications
Tool typePhotolithography step-and-repeat 1X stepper[1]—
Optical designWynne Dyson[1]—
Magnification1X[1]—
System type—Lithography system[1]
Application—Advanced packaging (AP)[1]
Platform—Unity Platform[1]
Platform introduction—Mid-2004 on AP bump tools[1]

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Sources (1)Every fact above is drawn from these public sources
  1. [1]en.wikipedia.orgen.wikipedia.org