Waferpedia

Comparison ledger

ACS300 Gen3versusAS8 / 12

SUSS MicroTec ACS300 Gen3, SUSS MicroTec AS8 / 12, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
ACS300 Gen3SUSS MicroTec
AS8 / 12SUSS MicroTec
OEMSUSS MicroTecSUSS MicroTec
Category——
Wafer size300mm300mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
GenerationGen3—
FamilySUSS MicroTec ACS300 Gen3SUSS MicroTec AS8 / 12
Specifications
System typeAutomated[1]—
Max wafer size300 mm[1]—
Process capabilitiesPriming, Spin Coating, Baking, Aqueous / Solvent Developing[1]—
Operation—Manual[1]
Wafer Size—up to 300 mm[1]
Process—Spray Coating[1]
Sources (1)Every fact above is drawn from these public sources
  1. [1]hilpert.chhilpert.ch