Waferpedia

Comparison ledger

150 e MaskversusDSC500

SUSS MicroTec 150 e Mask, SUSS MicroTec DSC500, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
150 e MaskSUSS MicroTec
DSC500SUSS MicroTec
OEMSUSS MicroTecSUSS MicroTec
CategoryLithographyLithography
Wafer size—450 x 500 mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilySUSS MicroTec 150 e MaskSUSS MicroTec DSC500
Specifications
Substrate size—up to 450 x 500 mm[1]
Type—Projection Lithography[1]
Automation—Automated system[1]
Exposure method—Full-Field Scanning Projection[1]
Alignment—Included[1]

Plan your fab

Building a Lithography process? Get a complete equipment list.

Open the fab equipment planner →
Sources (1)Every fact above is drawn from these public sources
  1. [1]hilpert.chhilpert.ch