Comparison ledger
STEAG Mecapol E 460, Strasbaugh 100R16, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Mecapol E 460STEAG | 100R16Strasbaugh |
|---|---|---|
| OEM | STEAG | Strasbaugh |
| Category | CMP | CMP |
| Wafer size | 4" | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | STEAG Mecapol E 460 | Strasbaugh 100R16 |
| Specifications | ||
| System type | semi-automatic system for polishing and planarization of wafers[1] | — |
| Wafer compatibility | 4", 6", and 8" wafers[1] | — |
| Other sample handling | other wafer sizes or chips can be processed by bonding them to a carrier wafer[1] | — |
| Slurry delivery | 2 pumps[1] | — |
| Conditioning system | ex-situ conditioning system[1] | — |
| Wafer size compatibility | 4", 6", 8"[1] | — |
| Slurry pumps | 2 pumps[1] | — |
| Equipment type | Semi-automatic CMP (chemical mechanical polishing) tool[1] | — |
| Wafer size | 4", 6", 8"[1] | — |
| Carrier wafer processing | Other wafer sizes or chips can be processed by bonding them to a carrier wafer[1] | — |
| Available slurries | 30N50, 30H50, 40EA50[1] | — |
| Oxide polishing target | Thermal oxide thickness range less than 500 A; removal rate 2600–2800 A/min; removal rate can be 2 to 5 times higher on deposited oxides[1] | — |
| Silicon polishing | Global removal around 8 to 10 µm for 10 min[1] | — |
| Consumable sets | Two sets: one for microelectronic layers polishing and one for copper polishing[1] | — |
| Microelectronic compatibility | Not a micro-electronic compatible tool[1] | — |
| Wafer size support | 4", 6", 8"[1] | — |
| Conditioning type | ex-situ[1] | — |
| Tool type | semi-automatic[1] | — |
| Type | semi-automatic system[1] | — |
| Process | polishing and planarization of wafers[1] | — |
| type | — | 1 spindle grinder/polisher[2] |
| drive system | — | DC drive system with 2 motors[2] |
| spindle RPM | — | 1-180 RPM[2] |
| eccentric RPM | — | 1-90 RPM[2] |
| controls | — | digital timer; air down switch; spindle and eccentric speed dials; air regulators[2] |
| capacity | — | 16 inches[2] |
| spindle size | — | 1-8 TPI[2] |
| overall dimensions | — | 28 inches x 36 inches x 48 inches[2] |
| weight | — | 500 lbs[2] |
| origin | — | made in the USA[2] |