Comparison ledger
Speedline FX D 8000 Underfill, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | FX D 8000 UnderfillSpeedline | 10490West Bond |
|---|---|---|
| OEM | Speedline | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Speedline FX D 8000 Underfill | West Bond 10490 |
| Specifications | ||
| Configuration | EQP, Dispense, UF,[1] | — |
| Make (OEM) | Speedline[1] | — |
| Model | FX D 8000[1] | 10490[2] |
| Equipment type | Underfill machine[1] | — |
| Product classification | EQP (Equipment), Dispense, UF (Underfill)[1] | — |
| Manufacturer | — | West Bond[2] |
| Description | — | Convertible bonder, wedge to ball[3] |
| Tool type | — | Convertible bonder[4] |
| Bonding modes | — | Wedge bonding and ball bonding[4] |
| Use | — | Wire bonding[4] |
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