Comparison ledger
Oxford Instruments PlasmaPro100, Tegal 6550, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | PlasmaPro100Oxford Instruments | 6550Tegal |
|---|---|---|
| OEM | Oxford Instruments | Tegal |
| Category | Etch | Etch |
| Wafer size | 100mm | 100mm |
| Process node | — | — |
| Introduced | — | 2000 |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | 2000 Patent announcement · 2001 Order announced |
| Control system | — | — |
| Generation | — | — |
| Family | Oxford Instruments PlasmaPro100 | Tegal 6550 |
| Cited variants | — |
|
| Specifications | ||
| OEM | Oxford[2] | — |
| Model | PlasmaPro100[2] | — |
| Equipment type | dry etcher[2] | — |
| Plasma source | ICP plasma etcher[2] | patented next-generation dual-frequency plasma source technology[3] |
| Wafer size | 100mm wafers[2] | 100mm–200mm[1] |
| Chemistry | chlorine and bromine chemistry[2] | — |
| Clamping | electrostatic clamping[2] | — |
| Compatibility | microelectronic compatible equipment[2] | — |
| Applications | metals etching; deep polymer etching; Si, SiO2 and Si3N4 thin films etching[2] | — |
| Endpoint detection | laser reflectometry/interferometry and optical emission spectroscopy (EOS) endpoint detection[2] | — |
| Tool type | ICP plasma etcher[2] | — |
| End-point detection | laser reflectometry/interferometry end-point-detection[2] | — |
| Product type | — | etch reactor / plasma etch system[3] |
| Process target | — | non-volatile metal and metal oxide films[3] |
| Primary application | — | volume production of magnetic memory components such as MRAM and GMR devices[3] |
| Platform | — | full cluster tool technology[3] |
| Process capability | — | patented rinse-strip-rinse feature / process capability[3] |
| Chamber configuration | — | dual-chamber platform[4] |
| Plasma source (later material) | — | Spectra plasma source[4] |
| Available option | — | deposition shield[3] |
| Type | — | plasma etch reactor[3] |
| Processes | — | etching non-volatile metal and metal oxide films[3] |
| Plasma source technology | — | patented next-generation, dual-frequency plasma source technology[3] |
| Variant | — | Spectra plasma source[4] |
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