Waferpedia

Comparison ledger

Plasmalab 80 Plusversus980

Oxford Instruments Plasmalab 80 Plus, Tegal 980, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
Plasmalab 80 PlusOxford Instruments
980Tegal
OEMOxford InstrumentsTegal
CategoryEtchEtch
Wafer size200mm200mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyOxford Instruments Plasmalab 80Tegal 980
Cited variants—
Specifications
Tool IDDE-04[2]—
TypeReactive Ion Etching (RIE)[2]—
Designcompact open-loading tool[2]—
RF generator600W[2]—
Wafer capacityup to 200mm wafers[2]—
Process gasesCF4, Ar, O2, SF6, CHF3[2]—
SuitabilityR&D or small-scale production[2]—
RF power600W[2]—
Maximum wafer size200mm[2]—
Tool typeReactive Ion Etching (RIE)[2]—
Wafer sizeUp to 200mm[2]200mm[1]
Loading typeOpen load[2]—
-ProcessPECVD—
-Voltage208 VAC, 3 Phase—
-Equipment componentMain body—
DescriptionOpen load reactive ion etch system[3]—
Wafer size designed for100 mm[3]—
Wafer size maximum200 mm[3]—
Platen size238 mm[3]—
Power range< 270 W[3]—
Etch targetsCompound semiconductors and metals[3]—
Series name—980 ACS Series[1]
Process type—Plasma etch[1]
System type—Single wafer cassette-to-cassette etch system[1]
Throughput—Faster throughput[1]
Calibration—Faster system calibration[1]
User interface—Touchscreen graphical user interface[1]
Data handling—Integrated data logging[1]
Factory automation—Factory automation support[1]
Tool format—Single wafer cassette-to-cassette etch system[1]
System calibration—Faster system calibration[1]
Automation—Factory automation support[1]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]nano.upenn.edunano.upenn.edu
  3. [3]cores.research.asu.educores.research.asu.edu