Comparison ledger
Oxford Instruments 100 ICP Fluorine, Tegal 981, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 100 ICP FluorineOxford Instruments | 981Tegal |
|---|---|---|
| OEM | Oxford Instruments | Tegal |
| Category | Etch | Etch |
| Wafer size | — | 150mm |
| Process node | — | — |
| Introduced | — | 1999 |
| Production run | — | 1999– |
| Lifecycle | — | Legacy |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Oxford Instruments 100 ICP Fluorine | Tegal 981 |
| Cited variants | — |
|
| Specifications | ||
| Etch Gases | SF6, CF4, O2, Ar, N2, CHF3, C4F8[2] | — |
| Cryo DRIE etch rate | up to 5 µm/min[2] | — |
| Wafer size | 4 inch, 6 inch, 8 inch (with clamp change)[2] | — |
| process type | — | plasma etch system[3] |
| application focus | — | thin film head fabrication[4] |
| etch result | — | precise photoresist descum[3] |
| anisotropy | — | 4:1[3] |
| processing temperature | — | low processing temperatures[3] |
| plasma chemistry | — | oxygen-free plasmas[3] |
| wafer size variant | — | 150mm–200mm[1] |
| Status | — | In Storage 8"[5] |
| Process type | — | plasma etch[3] |
| Primary function | — | precise photoresist descum[3] |
| Variant designation | — | 981 ACS[1] |
| Variant wafer size | — | 150mm–200mm[1] |
| Variant application | — | non-critical silicon nitride and photoresist trim processing[1] |
Plan your fab
Building a Etch process? Get a complete equipment list.
Open the fab equipment planner →