Comparison ledger
Nitto HR 8500 II UV Detaper, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 10490West Bond | |
|---|---|---|
| OEM | Nitto | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Nitto HR 8500 II UV Detaper | West Bond 10490 |
| Specifications | ||
| Configuration | With UV Function[1] | — |
| Manufacturer | Nitto Denko[2] | West Bond[5] |
| Model | HR 8500 II UV[2] | 10490[5] |
| UV function | With UV Function[2] | — |
| Manufacturer (alternate) | NITTO[3] | — |
| Part No. | HR8500-II UV[3] | — |
| Description (Korean) | Detaper撕膜机(带UV功能)[3] | — |
| Description | Detaper撕膜机(带UV功能) — detaper with UV function[3] | Convertible bonder, wedge to ball[6] |
| Condition | ASIS[3] | — |
| Quantity | 1[3] | — |
| Tool type | UV-equipped detaping tool[4] | Convertible bonder[7] |
| Bonding modes | — | Wedge bonding and ball bonding[7] |
| Use | — | Wire bonding[7] |
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