Comparison ledger
Nanometrics 210, Nanospec 4455, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 210Nanometrics | 4455Nanospec |
|---|---|---|
| OEM | Nanometrics | Nanospec |
| Category | Film Thickness Measurement | Film Thickness Measurement |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Nanometrics 210 | Nanospec 4455 |
| Cited variants |
| — |
| Specifications | ||
| OEM | Nanometrics[2] | — |
| Model | 210[2] | — |
| Application | Film thickness measurements up to 50um[2] | — |
| Model variant listing | Nanometrics 210 XP Scanning UV Nanospec/DUV Microspectrophotometer[1] | — |
| Thickness range | 100 to 500,000 angstroms[3] | — |
| Max film thickness | 50 µm[2] | — |
| Typical measurement time | 2.5 seconds[3] | — |
| Spot sizes | 50 µm (5x), 25 µm (10x), 6.5 µm (40x)[3] | — |
| Film types measured | Oxide on Silicon, Nitride on Silicon, Negative Resist on Silicon, Polysilicon on Oxide, Negative Resist on Oxide, Nitride on Oxide, Polyimide on Silicon, Positive Resist on Silicon, Positive Resist on Oxide[3] | — |
| Reproducibility | 5 Å ±5% depending on film type[3] | — |
| Spot Size | 50 µm with 5x objective; 25 µm with 10x objective; 6.5 µm with 40x objective[3] | — |
| Maximum Thickness (Duke) | 50 µm (500,000 angstroms)[2] | — |
| Equipment name | — | NanoSpec Film Thickness Measurement System[4] |
| Process specification entry | — | Nanospec 4455 A Si3N4 Thin Film[4] |
Plan your fab
Building a Film Thickness Measurement process? Get a complete equipment list.
Open the fab equipment planner →