Comparison ledger
Mattson 8800, YES 8-2P-CP, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 8800Mattson | 8-2P-CPYES |
|---|---|---|
| OEM | Mattson | YES |
| Category | Thermal / Diffusion | Thermal / Diffusion |
| Wafer size | 200mm | 200mm |
| Process node | 0.25-micron | — |
| Introduced | 1997 | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | 1997 Award recognition · 1997 Product award | — |
| Control system | — | — |
| Generation | third-generation | — |
| Family | Mattson 8800 | YES 8-2P-CP |
| Cited variants | — | |
| Specifications | ||
| Tool type | Third-generation RTP tool[2] | — |
| Process target | 0.25-micron process requirements[2] | — |
| Wafer size | 200 mm[2] | 200 mm wafers[1] |
| Wafer format | Single-wafer[2] | — |
| Temperature performance | Improves temperature uniformity and repeatability[2] | — |
| Throughput | Significantly boosts throughput[2] | — |
| Ceramic Shield option | Backside emissivity independence and better wafer-to-wafer repeatability[2] | — |
| Nitrogen curtain | Minimum pre-purge time and high-throughput configuration[2] | — |
| High process purge gas flow | Fast chamber purging for high-throughput configuration[2] | — |
| ez-DTC | High-throughput configuration and improved control[2] | — |
| High temperature end effector | High-throughput configuration[2] | — |
| Double O-ring seal system | Prevents product loss[2] | — |
| Swivel cassettes with independent swivels | Higher throughput[2] | — |
| Standard slip-free ring package | High temperature slip-free processing and improved uniformity[2] | — |
| Certifications | CE certified and UL listed[2] | — |
| Generation | third-generation RTP tool[2] | — |
| Process node | 0.25-micron[2] | — |
| Award | Semiconductor International Editor's Choice Best Product Award (1997)[2] | — |
| Model | — | 8-2P-CP[1] |
| Series | — | YES-PB Series[1] |
| Load type | — | manual load[3] |
| Process interface | — | touch screen interface enables the process to be fully automated[3] |
| Cooling package | — | uses air, no water[3] |
| Airflow | — | vertical laminar airflow[3] |
| Condensate control | — | coalescing condensate trap assembly[3] |
| Process type | — | manual-load high-temperature cure oven[3] |
| Applications | — | Polyimide/PBO cure; BCB bake; Low temp polymers cure; Copper anneal; Low-K dielectric cure; Copper oxide removal; Aluminum anneal[3] |
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