Waferpedia

Comparison ledger

Fusion HFTversusETS 200 T

LTX-Credence Fusion HFT, Teradyne ETS 200 T, side by side. Every value shown is drawn from the cited encyclopedia entries.

Documented as functional equivalents— Same function class: Test & Probe, Unknown[1]
Side-by-side comparison of selected equipment models
Attribute
Fusion HFTLTX-Credence
ETS 200 TTeradyne
OEMLTX-CredenceTeradyne
CategoryTest & ProbeTest & Probe
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLTX-Credence FusionTeradyne ETS 200
Specifications
Primary BUENT[2]—
DevelopmentNPI / Production[2]—
InstrumentFusion HFI[2]—
ConfigurationSolaris[2]With Electroglas EG 4090 & 4090 u+ Prober (8")[1]
Digital Pin512[2]—
Primary Business UnitENT[2]—
Development PhaseNPI / Production[2]—
SoftwareSolaris[2]—
Digital Pins512[2]—
Cage 0 ComponentsWorkstation, VME Crate VX4, AC/DC MPDU Crate, CPS (8 Channels), DPS (4 Channels), SMS (2 Channels), Analog Pin AP (16 Channels), RF 3500 (4 Channels), RF Generator R&S (3), Test Head User Power Supplies, Time Measurement Unit[2]—
Cage 1 ComponentsTesthead Digital Card Cage (512 Channels) PECVX, Power Supplies for Digital, Cooler, CTMU MUX / Wavecrest, DPRO 4 for VX4 (0 to 127 Channel)[2]—
Vintage2004[2]—

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing