Comparison ledger
Logitech 1 WBS 1 Wafer Substrate, Palomar 6500, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1 WBS 1 Wafer SubstrateLogitech | 6500Palomar |
|---|---|---|
| OEM | Logitech | Palomar |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Logitech 1 WBS 1 Wafer Substrate | Palomar 6500 |
| Specifications | ||
| Wafer Size | 6 inch[1] | — |
| Machine type | — | Die bonder[2] |
| Positioning system | — | Four-axis positioning system[2] |
| Drive mechanism | — | Linear motors gliding over air bearings[2] |
| Frame | — | Steel based frame[2] |
| Placement capability | — | Ultra-high accuracy eutectic and adhesive placements[2] |
| Cycle time | — | Under seven seconds[2] |
| Cycle Time | — | Under 7 seconds[2] |
| Placement Accuracy | — | Ultra-high[2] |
| Positioning Axes | — | Four-axis[2] |
| Drive System | — | Linear motors with air bearings[2] |
| Frame Material | — | Steel[2] |
| Supported Processes | — | Silver Sintering Die Bonding, Eutectic Die Bonding, Epoxy Die Bonding, UV Die Bonding, Solder Paste Die Bonding[3] |
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