Comparison ledger
Laurell EDC-HL-23, Laurell H6-15, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | EDC-HL-23Laurell | H6-15Laurell |
|---|---|---|
| OEM | Laurell | Laurell |
| Category | Spin coater | Spin coater |
| Wafer size | 150mm | 300mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | 650-series | — |
| Family | Laurell EDC-HL-23 | Laurell H6-15 |
| Cited variants |
| — |
| Specifications | ||
| Process controller | 650-series process controller[1] | — |
| Wafer capacity | Up to 150 mm wafers[1] | — |
| Substrate capacity | Up to 5 in x 5 in (127 mm x 127 mm) substrates[1] | — |
| Maximum rotation capability | 12,000 RPM with vacuum hold-down[1] | — |
| Recommended operating speed | 3,000 RPM with non-vacuum chucks[1] | — |
| Power | 95 to 240 VAC, 47/63 Hz, ~300 Watts[1] | 95 to 240VAC, 47/63HZ, ~300 Watts[2] |
| Nitrogen/CDA seal purge pressure | 60–70 PSIG (4–5 bar)[1] | — |
| Vacuum recommendation | 25–28 inches Hg with 4.5 SCFM at 0 inches Hg[1] | — |
| Model | — | H6-15[2] |
| Series | — | 650-series HL coater system[2] |
| Maximum wafer size | — | Up to ø 300mm wafers[2] |
| Maximum substrate size | — | 9" × 9" (229mm × 229mm) substrates[2] |
| Maximum rotational speed | — | 12,000 RPM[2] |
| Controller/software | — | Wireless tablet featuring Laurell Touch process control software; accompanying PC software Spin 3000 is also mentioned[2] |
| Required nitrogen/CDA purge | — | 60–70 PSIG (4–5 bar)[2] |
| Vacuum | — | 25–28 inches Hg suggested; 4.5 SCFM at 0 inches Hg[2] |
| Wafer size | — | up to ø 300mm wafers[2] |
| Substrate size | — | 9" × 9" (229mm × 229mm) substrates[2] |
| Speed basis | — | based on a ø 100mm silicon wafer[2] |
| Control software | — | Laurell Touch process control software with accompanying Spin 3000 PC software[2] |
| Controller | — | wireless tablet[2] |
| Gas purge | — | 60–70 PSIG Nitrogen/CDA[2] |
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