Comparison ledger
Laurell EDC-650-15, Laurell EDC-650-23, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | EDC-650-15Laurell | EDC-650-23Laurell |
|---|---|---|
| OEM | Laurell | Laurell |
| Category | Spin coater / spin processor | Spin coater / spin processor |
| Wafer size | 300mm | 150mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | 650-series | — |
| Family | Laurell EDC-650-15 | Laurell EDC-650-23 |
| Cited variants |
|
|
| Specifications | ||
| Model | EDC-650-15 B[1] | EDC-650-23[2] |
| System type | Station mounted EDC-650-15 spin processor[1] | — |
| Wafer capacity | up to Ø 300 mm wafers[1] | Up to Ø 150 mm wafers[2] |
| Substrate capacity | 9" × 9" (229 mm × 229 mm) substrates[1] | Up to 5" × 5" (127 mm × 127 mm) substrates[2] |
| Maximum speed capability | 12,000 RPM with vacuum hold-down[1] | — |
| Recommended speed | 3,000 RPM[1] | — |
| Recommended chuck type | non-vacuum chucks[1] | — |
| Process controller | 650-series process controller[1] | — |
| Power | 95 to 240 VAC, 47/63 Hz, ~300 W[1] | 95 to 240 VAC, 47/63 HZ, ~300 Watts[2] |
| Required nitrogen/CDA purge pressure | 60–70 PSIG (4–5 bar)[1] | — |
| Suggested vacuum | 25–28 inches Hg[1] | — |
| Supported processes | Etch, Develop, Clean, typically followed by solvent or aqueous rinse, then dry[1] | — |
| Substrate size maximum | Up to Ø 300 mm wafers and 9" × 9" (229 mm × 229 mm) substrates[1] | — |
| Maximum rotational speed | 12,000 RPM (with vacuum hold-down)[1] | — |
| Recommended rotational speed | 3,000 RPM (with non-vacuum chucks)[1] | 3,000 RPM with non-vacuum chucks[2] |
| Power requirements | 95 to 240 VAC, 47/63 Hz, ~300 W[1] | — |
| Nitrogen / CDA purge pressure | 60–70 PSIG (4–5 bar) for motor seal and chamber purge[1] | — |
| Nitrogen consumption (standard motor) | 3 cubic feet per hour (0.085 m³/hour)[1] | — |
| Nitrogen consumption (high-performance motor) | 20 cubic feet per hour (0.566 m³/hour)[1] | — |
| Vacuum requirement | 25–28 inches Hg (~635–711 mm Hg) at 4.5 SCFM (0.127 m³/min)[1] | — |
| Housing material (standard) | Solid co-polymer blend (proprietary, solvent- and acid-resistant)[1] | — |
| Housing material (optional) | Solid PTFE Hostaflon TFM-1600 / Teflon AF[1] | — |
| Safety certifications | CE and RoHS compliant; UL and CSA approved components; ETL certification mentioned[1] | ETL certification, UL and CSA approval of components; CE and RoHS compliant[2] |
| Series | — | 650-series EDC system[2] |
| Configuration | — | Station mounted[2] |
| Maximum rotational capability | — | 12,000 RPM with vacuum hold-down[2] |
| Substrate size | — | up to Ø 150mm wafers and 5" x 5" (127mm x 127mm) substrates[2] |
| RPM capability | — | 12,000 RPM with vacuum hold-down; recommended for only 3,000 RPM and non-vacuum chucks[2] |
| High-performance drive | — | up to 12,000 RPM (depending upon the controller, chuck material, substrate size and mass)[3] |
| N2 Process/Seal Purge | — | 60–70 PSIG (4–5 bar) of Nitrogen/CDA; gas consumption 3 cubic feet per hour (0.085 m3/hour); 10 feet (300 cm) of 3/16 inch (~4 mm) inside diameter X 1/4 inch (~6 mm) outside diameter PE tubing provided[2] |
| Vacuum | — | 25–28 inches (~635–711mm) Hg of vacuum with a flow volume of 4.5 SCFM (0.127 cubic meters/minute) at 0 inches Hg; 10 feet (300 cm) of 3/8 inch (~9.5 mm) outside diameter X 1/4 inch (~6 mm) inside diameter PE tubing provided[2] |
| Controller | — | 650-series process controller; operator interaction in real-time during process execution including pausing time, stopping and continuing; field-updatable with downloadable firmware revisions; can be used with PC and Spin 3000 software, but PC not required[2] |
| Housing material | — | typically solid co-polymer blend exclusive to Laurell Technologies; solid PTFE Hostaflon TFM-1600 / Teflon AF housing available[2] |
| Chamber top material | — | clear top made from ECTFE unless otherwise stated; ECTFE-coated 316 stainless steel screws used in some non-wetted areas[2] |
| Exhaust and drain | — | standard adjustable down-flow exhaust and drain; exhaust monitored by the process controller[2] |
| Chuck recommendation | — | exclusive use of non-vacuum chucks recommended with EDC systems[2] |
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