Comparison ledger
Laurell 400-series, Laurell WS-650, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 400-seriesLaurell | WS-650Laurell |
|---|---|---|
| OEM | Laurell | Laurell |
| Category | Spin coater | Spin coater |
| Wafer size | 150mm | 150mm |
| Process node | — | — |
| Introduced | 1995 | — |
| Production run | 1995– | — |
| Lifecycle | Discontinued | — |
| Lifecycle milestones | 2011 End of life | — |
| Control system | — | — |
| Generation | — | — |
| Family | Laurell 400-series | Laurell WS-650 |
| Cited variants |
| — |
| Specifications | ||
| Process controller | 400-series process controller capable of storing and automatically running process recipes consisting of run time and acceleration rate, with manual operation also supported[1] | — |
| Spin speed | 10,000 RPM (based on a 100 mm SEMI Std. wafer)[2] | — |
| Maximum wafer size | Up to 150 mm wafers[2] | — |
| Substrate size | 4" x 4" (102 mm x 102 mm) substrates[2] | Up to 150 mm round substrates and 125 mm square substrates[3] |
| Standard chuck | 1.75" (45 mm) diameter vacuum chuck[2] | — |
| Standard adapter coverage | One fragment adapter standard covering 10 mm through 150 mm SEMI wafers[1] | — |
| Housing material | Solid co-polymer blend exclusive to Laurell Technologies[1] | — |
| Power | 95 to 240 VAC, 47/63 Hz, ~300 Watts[1] | — |
| Vacuum suggestion | 25–28 inches Hg vacuum with 4.5 SCFM flow at 0 inches Hg suggested[1] | — |
| Maximum substrate size | Ø150 mm wafers and 4" × 4" (102 mm × 102 mm) substrates[2] | — |
| Maximum speed | 10,000 RPM (based on a Ø100 mm SEMI Std. wafer)[2] | — |
| Vacuum chuck diameter | 1.75" (45 mm) diameter vacuum chuck[1] | — |
| Fragment adapter coverage | 10 mm through 150 mm SEMI wafers[1] | — |
| Power requirement | 95 to 240VAC, 47/63HZ, ~300 Watts[1] | — |
| Equipment type | — | Cleanroom Instrumentation; Thin Film Fabrication[3] |
| Use | — | Should be used only for spincoating of photoresists[3] |
| Speed range | — | 100-12,000 RPM[3] |
| Substrate thickness | — | 0.1 to 1 mm[3] |
| Adapter | — | Wafer Fragment Adapter for 10–50 mm substrate fragments[3] |
| Location | — | FNT 4.106[3] |
| Installed location | — | Photolithography hood[3] |
| Model | — | Laurell WS-650[4] |
| Type | — | Spin coater[4] |
| Purpose | — | Coating photoresist on samples of various sizes[4] |
| Wafer size support | — | 50 mm through 150 mm substrates[4] |
| Controller speed range | — | 100-8000 rpm[4] |
| Speed resolution | — | 0.5 rpm[4] |
| Program capacity | — | Up to twenty 51-step programs[4] |
| Vacuum chuck | — | 1.75 inch natural propylene vacuum chuck[4] |
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