Comparison ledger
Kurt Lesker ALD-150LX, Temescal UEFC-4900, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | ALD-150LXKurt Lesker | UEFC-4900Temescal |
|---|---|---|
| OEM | Kurt Lesker | Temescal |
| Category | Deposition | Deposition |
| Wafer size | 150mm | 150mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Kurt Lesker ALD-150LX | Temescal UEFC-4900 |
| Specifications | ||
| OEM | Kurt Lesker[1] | — |
| Model | ALD-150LX[1] | — |
| Load-locked | Yes[2] | — |
| In situ ellipsometer | Film Sense FS-1 Multi-Wavelength[2] | — |
| Available film growth by request | Al2O3, HfO2, ZrO2, HfZrO2, TiN, Ga2O3[2] | — |
| Maximum film thickness stated | up to 20 nm[2] | — |
| Substrate specification | No exposed organics such as polymers[2] | — |
| Small samples | Able to be clipped to wafer carrier[2] | — |
| Source listing | — | Temescal UEFC-4900 is named in the Temescal systems navigation/lineup[3] |
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