Comparison ledger
Kulicke & Soffa IConn ProCu Plus LA, West Bond 10100, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | IConn ProCu Plus LAKulicke & Soffa | 10100West Bond |
|---|---|---|
| OEM | Kulicke & Soffa | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Kulicke & Soffa IConn | West Bond 10100 |
| Specifications | ||
| Configuration | for Parts[1] | — |
| Type | Fully automatic wire bonder[2] | — |
| Purpose | Make the electric connexion between the chip and the substratum with a gold or a copper wire[2] | — |
| Typical product | Typical ultra-fine pitch ball grid array product[2] | — |
| Minimum pad pitch | 35 µm[2] | — |
| Accuracy | 2 µm @ 3 sigma[2] | — |
| Minimum wire diameter | 0.6 mils[2] | — |
| Bond area | 56 mm x 87 mm[2] | — |
| Wire options | Copper wire option with forming gas[2] | — |
| Advanced node capability | Advanced node wafers down to 28 nm or below[2] | — |
| Process development/control | Wire pull and ball shear available[2] | — |
| Alternate wire option | Option de soudure de fil coincé sous capillaire (capillary wedge, wedge-to-wedge) with aluminum or gold wire[3] | — |
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