Comparison ledger
Kulicke & Soffa 8060 Wedge, Logitech 1 WBS 1 Wafer Substrate, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 8060 WedgeKulicke & Soffa | 1 WBS 1 Wafer SubstrateLogitech |
|---|---|---|
| OEM | Kulicke & Soffa | Logitech |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | 1999 Vintage year of known unit · 2000 Vintage date of known unit | — |
| Control system | — | — |
| Generation | — | — |
| Family | Kulicke & Soffa 8060 Wedge | Logitech 1 WBS 1 Wafer Substrate |
| Specifications | ||
| Bonding Type | Wedge[1] | — |
| Automation Level | Automatic[2] | — |
| Wire Materials | Gold, Aluminum[2] | — |
| Wafer Size | 200 mm[2] | 6 inch[5] |
| Manufacturer | Kulicke & Soffa[1] | — |
| Model | 8060 Wedge[3] | — |
| Category | Packaging & Bonding[1] | — |
| Machine type | Packaging and bonding machine[1] | — |
| Bonder type | Automatic gold and aluminum wedge bonder[2] | — |
| Vintage year | 1999[4] | — |
| Vintage date | 2000-09-01[2] | — |
| Software Version | P805747[4] | — |
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