Waferpedia

Comparison ledger

2014-09-11T12versusUP 2000 HIE

Koh Young 2014-09-11T12, Speedline UP 2000 HIE, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
2014-09-11T12Koh Young
UP 2000 HIESpeedline
OEMKoh YoungSpeedline
CategoryAssembly / SMTAssembly / SMT
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyKoh Young 2014-09-11T12Speedline UP 2000 HIE
Specifications
Semiconductor SolutionsListed as one of the company’s business areas[1]—
Print Area—18" x 16" (457 x 406 mm)[2]
Alignment Accuracy—+/- 0.001" at 6 sigma[2]
Cycle Time—< 11 seconds[2]
Vision System—Advanced vision algorithms for fast fiducial processing[2]
Self-leveling print head—Yes[2]
Closed-loop squeegee pressure control—Available as option[2]
Automatic support pin placement system—Available as option[2]
Full environmental control—Available as option[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]goppm.comgoppm.com