Comparison ledger
KLA Candela CS 20 V Surface Analyzer, PR Hoffman 108T, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 108TPR Hoffman | |
|---|---|---|
| OEM | KLA | PR Hoffman |
| Category | CMP | CMP |
| Wafer size | 2" | up to 12 in wafers |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | KLA Candela CS 20 | PR Hoffman 108T |
| Cited variants |
| — |
| Specifications | ||
| Configuration | Violet Laser (405nm, 25mW)[1] | — |
| Phase | Laser: 405 nm, 25 mW diode - Spot size: 5 × 6 µm Detection modes: - Scattered light - Specular reflection - Phase shift - Surface topography[2] | — |
| Wafer size | Wafer Handling: - Sizes: 2", 3", 4", 5", 6", 8" - Thickness: 0.2–1.1 mm - Automatic robotic transfer - Cassette-to-cassette operation[2] | — |
| Laser wavelength | 405 nm[2] | — |
| Laser power | 25 mW[2] | — |
| Spot size | 5 × 6 µm[2] | — |
| Detection modes | Scattered light, specular reflection, phase shift, surface topography[2] | — |
| Wafer sizes supported | 2", 3", 4", 5", 6", 8"[2] | — |
| Wafer thickness range | 0.2–1.1 mm[2] | — |
| Particle detection threshold | 0.08 µm (PSL equivalent)[2] | — |
| Particle detection rate | ≥95% on polished wafers[2] | — |
| Scratch detection dimensions | Length: 100 µm, Width: 0.1 µm, Depth: 50 Å[2] | — |
| Pit/Bump detection dimensions | Diameter: 20 µm, Depth: 50 Å[2] | — |
| Stain detection dimensions | Diameter: 20 µm, Film thickness: 10 Å[2] | — |
| Topography vertical resolution | 1 Å[2] | — |
| Wafer handling | Automatic robotic transfer, cassette-to-cassette[2] | — |
| Operating system | Windows XP[3] | — |
| Power supply | 230 VAC 50/60 Hz[3] | — |
| Cleanroom environment | Internal class 10[3] | — |
| Wafer sizes | 2", 3", 4", 5", 6", 8"[2] | — |
| Particle detection minimum size | 0.08 µm (PSL equivalent)[2] | — |
| Particle detection rate (polished wafers) | ≥95%[2] | — |
| Scratch detection minimum length | 100 µm[2] | — |
| Scratch detection minimum width | 0.1 µm[2] | — |
| Scratch detection minimum depth | 50 Å[2] | — |
| Pit/Bump detection minimum diameter | 20 µm[2] | — |
| Pit/Bump detection minimum depth | 50 Å[2] | — |
| Stain detection minimum diameter | 20 µm[2] | — |
| Stain detection minimum film thickness | 10 Å[2] | — |
| Vintage | 2012[1] | — |
| carrier type listing | — | 108T 9B - S/F / Lapmaster LSP-9 / etc.[4] |
| machine class | — | for double-sided planetary lapping & polishing machines[4] |
| wafer sizes stated on insert-carrier page | — | 3 in, 4 in, 5 in, 6 in, 8 in, and 12 in wafers[4] |
| maximum carrier diameter stated on insert-carrier page | — | up to 33 in diameter[4] |
| maximum carrier diameter stated on lapping-carrier page | — | up to 48 in diameter[5] |