Comparison ledger
KLA 1.112 PSL Wafer, Onto Innovation NSX 105 Automated Wafer, Die & Bump, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | NSX 105 Automated Wafer, Die & BumpOnto Innovation | |
|---|---|---|
| OEM | KLA | Onto Innovation |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | KLA 1.112 PSL Wafer | Onto Innovation NSX 105 |
| Specifications | ||
| Configuration | NIST Traceable[1] | Single phase + GND[3] |
| Wafer Size | 8 inch[1] | — |
| NIST Traceable | True[1] | — |
| Compatible Tools | Surfscan 6xy0 and Sp1[2] | — |
| Full load | — | 6 amps[3] |
| Largest load | — | 1.5 amps[3] |
| Power | — | 200-240 VAC[4] |
| Largest Load | — | 1.5Amps[4] |
| Main Breaker | — | 20 Amps/10,000 AIC[4] |
| Objectives | — | 1, 2, 5, 20x[5] |
| Wafer Sizes | — | 4, 6, 8 inch[5] |
| System Type | — | Automatic Defect Inspection System[4] |
| Power Supply | — | 200-240 VAC, 50/60 Hz[4] |
| Full Load Current | — | 6 Amps[4] |
| Main Breaker Rating | — | 20 Amps/10,000 AIC[4] |
| Phase Configuration | — | 1 Phase + GND[4] |
| Known Vintage (example unit) | — | 2008[3] |
| Inspection Cameras | — | Adimec inspection camera, Toshiba for color review[5] |
| Focus Sensor | — | Laser focus sensor[5] |
| Stage | — | Worm screw for Y, Linear for X[5] |
| Theta Controller | — | NSK controller[5] |
| Control Electronics | — | 1 Genesis main board, 3 Genesis Node board[5] |
| Computer | — | PC[5] |
| Largest Load Current | — | 1.5 A[3] |
| Inspection Camera | — | Adimec[5] |
| Color Review Camera | — | Toshiba[5] |
| Laser Focus Sensor | — | Present[5] |
| Motion System | — | Y-axis: worm screw; X-axis: linear; Theta: NSK controller[5] |
| Control Computer | — | PC[5] |
| Control Boards | — | 1 Genesis main board, 3 Genesis Node board[5] |
| Year of Manufacture (one unit) | — | 2008[3] |
| Wafer sizes | — | 4 inch, 6 inch, 8 inch[5] |
| Theta controller | — | NSK[5] |
| Top plate | — | Ultraport[5] |
| Genesis boards | — | 1 main board, 3 node boards[5] |
| Motion | — | Y: worm screw, X: linear[5] |
| Vintage | — | 2008[3] |
| Robot | — | Not present[3] |
| Type | — | Automatic Defect Inspection System[4] |
| Color Review | — | Toshiba for color review[5] |
| Controller Boards | — | 1 genesis main board, 3 Genesis Node board[5] |
| Ultraport Top Plate | — | Ultraport top plate[5] |
| Model | — | NSX 105[6] |
| Machine type | — | Automated Wafer, Die & Bump Inspection System[6] |
| X axis | — | Linear for X[5] |
| Y axis | — | Worm screw for Y[5] |
| Theta | — | NSK controller for theta[5] |
| Color review | — | Toshiba[5] |
| Main board | — | 1 genesis main board[5] |
| Node board | — | 3 Genesis Node board[5] |
Plan your fab
Building a Metrology & Inspection process? Get a complete equipment list.
Open the fab equipment planner →