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Comparison ledger

0035235-003 MMD HeadversusS8000X

KLA 0035235-003 MMD Head, Tescan S8000X, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
S8000XTescan
OEMKLATescan
CategoryMetrology & InspectionMetrology & Inspection
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyKLA 0035235-003 MMD HeadTescan S8000X
Specifications
ConfigurationTSTD PCB ASSY, MMD MEAS HEAD[1]—
Model0035235-003[1]—
MakeKLA[1]—
Part DescriptionTSTD PCB ASSY, MMD MEAS HEAD[1]—
Compatible SystemKLA AIT-XP[1]—
Instrument type—Plasma-source focused ion beam microscope and high-resolution BrightBeam scanning electron microscope[2]
Ion source—Xe+ ion plasma source[2]
Focused beam current—Up to 1 uA[2]
Milling rate—Up to 50X faster than prior Ga+ ion technology[2]
Electron microscope optics—Field-free, ultra-high resolution optics with improved low-energy imaging[2]
Analytical capability—Time-of-Flight Secondary Ion Mass Spectrometry (ToF-SIMS)[2]
Cryogenic capability—Cryogenic stage and sample transfer loadlock allowing work down to -160 C or introduction of frozen samples[2]
Nanomanipulator—Cryogenic Kleindiek nanomanipulator for in-situ interaction and lift-out of frozen sections for subsequent TEM analysis[2]
Ion source type—Xe+ ion plasma source[2]
Maximum focused beam current—1 uA[2]
Electron source type—BrightBeam SEM, field-free, ultra-high resolution[2]
Analytical capabilities—ToF-SIMS and EDS[2]
Cryogenic stage temperature range—down to -160 C[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]nano.upenn.edunano.upenn.edu