Waferpedia

Comparison ledger

GLversus2014-09-11T12

Juki GL, Koh Young 2014-09-11T12, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
GLJuki
2014-09-11T12Koh Young
OEMJukiKoh Young
CategoryAssembly / SMTAssembly / SMT
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyJuki GLKoh Young 2014-09-11T12
Cited variants—
Specifications
Machine type (GL Plus)Fully automatic screen printer[1]—
Process alignment (GL Plus)2 Cpk @ ±25 microns 6 sigma[1]—
Product changeover time (GL Plus)2 minutes[1]—
New product setup time (GL Plus)10 minutes[1]—
Max PCB size (GL Plus)510 mm (L) x 510 mm (W)[1]—
PCB thickness (GL Plus)0.4 mm to 6 mm[1]—
Max PCB weight (GL Plus)5 kg[1]—
Max conveyor speed (GL Plus)1500 mm/sec[1]—
Adjustable stencil X frame size range (GL Plus)480 x 500 mm to 737 x 737 mm, without using any stencil adaptor[1]—
Stencil clamping (GL Plus)8 plungers (4 on each side)[1]—
Squeegee beam (GL Plus)Arch shape, solidly cast high intensity steel[1]—
Paste roll height monitoring (GL Plus)Real-time laser-based system measuring solder paste bead diameter during printing stroke[1]—
Interfaces (GL Plus)SMEMA, USB, Ethernet[1]—
Semiconductor Solutions—Listed as one of the company’s business areas[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]swsystems.comswsystems.com
  2. [2]waferpedia.comwaferpedia.com
  3. [3]web.archive.orgweb.archive.org