Comparison ledger
Hesse & Knipps BJ 820 Wire Bonder Transport, Logitech 1 WBS 1 Wafer Substrate, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | BJ 820 Wire Bonder TransportHesse & Knipps | 1 WBS 1 Wafer SubstrateLogitech |
|---|---|---|
| OEM | Hesse & Knipps | Logitech |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Hesse & Knipps BJ 820 Wire Bonder Transport | Logitech 1 WBS 1 Wafer Substrate |
| Specifications | ||
| Make | Hesse & Knipps (H&K)[1] | — |
| Model | BJ 820[1] | — |
| Description | Wire Bonder Transport System[1] | — |
| Vintage | 2013[1] | — |
| Work area | 305 mm x 410 mm[2] | — |
| Type | High Speed Fully Automatic Wedge Bonder[2] | — |
| Wire materials | Aluminium or gold wire or ribbon[2] | — |
| Equipment type | Wire Bonder Transport System[1] | — |
| Machine description | High Speed Fully Automatic Wedge Bonder[2] | — |
| Working area | 305 mm x 410 mm (12.3" x 16.14")[2] | — |
| Speed | Up to 7 wires per second[2] | — |
| Wire diameter range | 17.5 μm – 60 μm; optional 12.5 μm – 85 μm[2] | — |
| Ribbon materials | Al, Au[2] | — |
| Ribbon range | 6 μm x 35 μm – 25 μm x 250 μm[2] | — |
| Footprint | 722 mm x 1250 mm[2] | — |
| Integrated controls | Integrated PLC controller; standard SMEMA input and output ports; Profibus support[2] | — |
| Wafer Size | — | 6 inch[3] |
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